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EDIsecure DIC10352 0.6 Mil 3 Globes Holographic Patch Laminate Chip Cut-Out
EDIsecure DIC10352 Holographic Patch Laminate
0.6 mil thickness
3 Globes Design
ISO Contact Chip Cut-Out
550 imprints per roll
*For use with the following EDIsecure lamination modules:
ILU Inline Lamination Unit
ILM Inline Lamination Module
ILM-LS Inline Lamination Module (Lower Side)
ILM-DS Inline Lamination Module (Dual Side)
*For use with the following EDIsecure printers with lamination:
XID560ie
XID570ie
XID580ie
XID590ie
XID9300
XID9330
DCP360+
XID8300
**Note: If performing inline mag encoding, this will not work in the Lower cassete of an ILM-DS or in an ILM-LS.
If the holographic artwork design is registered in relation to the card layout, then Registered will appear in the item name.
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